Thermal Strain Relief for High Power Applications
The Autosplice S-Tab Terminal is designed to relieve thermal-induced stresses in assemblies that utilize insulated metal substrates. This feature helps to ensure interconnect solder joint integrity for the life of the product.
Autosplice offers quick-turn design capabilities to provide the S-Terminals in custom frames to ensure maximum coplanarity and facilitate automatic placement.
Additional information (PDF 0,4MB)
